ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,972, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Methods used in forming a memory array comprising strings o... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,973, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices, and related memory devices, electr... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,974, issued on April 7, was assigned to XINTEC INC. (Taoyuan City, Taiwan). "Chip package and manufacturing method thereof" was invented by... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,975, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device" was invented by J... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,976, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device" was invented by Jeo... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,977, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Fill of vias in single and dual damascene structures using self... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,978, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a source/drain c... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,979, issued on April 7, was assigned to Apple Inc. (Cupertino, Calif.). "Dual contact and power rail for high performance standard cells" w... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,980, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Front end of line processing compatible ther... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,981, issued on April 7, was assigned to QUALCOMM Inc. (San Diego). "Port landing-free low-skew signal distribution with backside metallizat... Read More